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JAT Stream Inc. was founded in 2005 with the objective of providing high precision cutting using water jet technology, which can be used on curvilinear designs. The Company has identified a new water jet technology known as Abrasive Suspension Jet (ASJ).
In contrast with traditional saw-cutting techniques used in the semiconductor packaging industry, water-jet technology uses micro-abrasive based water pressure as a cutting method, providing a more precise and cost-effective process for fully flexible geometry semiconductor packages and other miniature devices.
Water-jet technology is a compelling alternative to saw cutting for many of today’s popular small form factor packages, offering the potential to significantly improve manufacturing yields, quality and reliability.
President - Kim Tan
Kim Tan has held technical and management posts in the semiconductor industry for more than 23 years. An expert in international business, Mr. Tan started his semiconductor career in Penang, Malaysia. He relocated to California after accepting the top operational post at Tool and Die Masters. After running the design, engineering, and sales departments at TOWA Intercon Technology, Inc., and assumed the President position in 1999. The most critical aspect of Mr. Tan’s profile is that he led a world leader in Semiconductor Singulation markets with over 75% share and brought state of the art robotics and automation of a fully automated system to capitalize from the latest abrasive suspension jet evolution for the industry.
Chief Technology Officer -
Shan Jiang, Ph.D.
Dr. Jiang has been in the Waterjet industry for over 21 years and invented the Waterjet Singulation System for semiconductor industry. He has contributed significantly in developing Abrasive Suspension Jet cutting technology that represents the forefront of the research being carried out in Waterjet technology.
