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Fine cut kerfs ranging from 0.150mm to 0.350mm. |
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High precision within 0.025 micron tolerance. |
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High quality finish: no copper smearing, no bottom edge chipping, no vertical burring. |
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Cold cut virtually any material without heat dissipation. |
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High ability: singulates small semiconductor devices and curvilinear photonic devices. |
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High cutting speed with low reaction force. |
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Acceptable investment and cutting cost. |
